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BeRex Inc BCG004

RF MOSFET HEMT 28V DIE

Answer first: this page is a purchasing reference for the exact part number BCG004 from BeRex Inc. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: BeRex Inc Part number: BCG004 Package: Die RFQ verification required

Key Parameters

Part NumberBCG004
ManufacturerBeRex Inc
CategorySingle FETs, MOSFETs
packageDie
series-
packagingTray
product statusActive
param 1HEMT
param 2-
param 326GHz
param 410.5dB
param 528 V
param 6620mA
param 7-
param 840 mA
param 94W
param 1090 V
param 11-
param 12-
param 13-
param 14Die

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify BCG004 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For BCG004, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.