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Bishop-Wisecarver UTCCA2-227

UT WP ASMB WHEEL 227

Answer first: this page is a purchasing reference for the exact part number UTCCA2-227 from Bishop-Wisecarver. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Bishop-Wisecarver Category: Structural, Motion Hardware Part number: UTCCA2-227 Package: RFQ verification required

Key Parameters

Part NumberUTCCA2-227
ManufacturerBishop-Wisecarver
CategoryStructural, Motion Hardware
seriesUtiliTrak®
packagingBulk
product statusActive
param 1Wheel Plate
param 24.920" L x 1.417" W x 2.165" H (124.97mm x 35.99mm x 54.99mm)

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify UTCCA2-227 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For UTCCA2-227, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.