Brady Corporation XSL-133-427
LAB STRAW LBLSMALL-B427-.375X1.7
Answer first: this page is a purchasing reference for the exact part number XSL-133-427 from Brady Corporation. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.
Key Parameters
| Part Number | XSL-133-427 |
|---|---|
| Manufacturer | Brady Corporation |
| Category | Labels, Labeling |
| series | IDXPERT™ |
| packaging | Bulk |
| product status | Obsolete |
| param 1 | Self Laminating |
| param 2 | 1.75" W x 1.00" L (44.5mm x 25.4mm) |
| param 3 | White, Transparent |
| param 4 | Vinyl |
| param 5 | - |
| param 6 | - |
| param 7 | - |
| param 8 | - |
Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.
How to Verify XSL-133-427 Before Ordering
Datasheet and parameter checks
- Confirm the full manufacturer part number, not only a shortened search keyword.
- Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
- Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.
RFQ fields SENICO needs
- Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
- State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
- Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.
For XSL-133-427, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.
We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.
Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.