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ebm-papst Inc. LZ30P

FINGER GUARD PLAST 4000,9000 SER

Answer first: this page is a purchasing reference for the exact part number LZ30P from ebm-papst Inc.. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: ebm-papst Inc. Category: Finger Guards, Filters & Sleeves Part number: LZ30P Package: RFQ verification required

Key Parameters

Part NumberLZ30P
Manufacturerebm-papst Inc.
CategoryFinger Guards, Filters & Sleeves
series-
packagingBulk
product statusActive
param 1Finger Guard
param 2119mm Sq
param 34000, 9000 Series
param 46 Rings
param 5Plastic

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify LZ30P Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For LZ30P, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.