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Greenlee Communications 45565

DIE SET MINI INS TERM. 26-16AWG

Answer first: this page is a purchasing reference for the exact part number 45565 from Greenlee Communications. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Greenlee Communications Category: Crimp Heads, Die Sets Part number: 45565 Package: RFQ verification required

Key Parameters

Part Number45565
ManufacturerGreenlee Communications
CategoryCrimp Heads, Die Sets
seriesKwik Cycle® 9
packagingBulk
product statusActive
param 1Die Set
param 2Splices and Terminals, 16-26 AWG
param 3-
param 445504
param 5-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 45565 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 45565, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.