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TDK Corporation SP13808

SESUB-PAN-T2541 EVAL MODULE

Answer first: this page is a purchasing reference for the exact part number SP13808 from TDK Corporation. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: TDK Corporation Category: RF, RFID, Wireless Evaluation Boards Part number: SP13808 Package: RFQ verification required

Key Parameters

Part NumberSP13808
ManufacturerTDK Corporation
CategoryRF, RFID, Wireless Evaluation Boards
series-
packagingBox
product statusActive
param 1Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
param 22.4GHz
param 3Board(s)
param 4SESUB-PAN-T2541

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify SP13808 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For SP13808, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.