TE Connectivity AMP Connectors 638187-2
CONN SOCKET 22AWG CRIMP TIN
Answer first: this page is a purchasing reference for the exact part number 638187-2 from TE Connectivity AMP Connectors. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.
Key Parameters
| Part Number | 638187-2 |
|---|---|
| Manufacturer | TE Connectivity AMP Connectors |
| Category | Rectangular Connector Contacts |
| series | - |
| packaging | Tape & Reel (TR) |
| product status | Last Time Buy |
| param 1 | - |
| param 2 | Socket |
| param 3 | Crimp |
| param 4 | 22 AWG |
| param 5 | Tin |
| param 6 | 80.0µin (2.03µm) |
Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.
How to Verify 638187-2 Before Ordering
Datasheet and parameter checks
- Confirm the full manufacturer part number, not only a shortened search keyword.
- Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
- Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.
RFQ fields SENICO needs
- Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
- State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
- Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.
For 638187-2, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.
We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.
Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.