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Tempo Communications PA3814

TOOL REPLACEMENT PUNCH HEAD

Answer first: this page is a purchasing reference for the exact part number PA3814 from Tempo Communications. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Tempo Communications Category: Crimp Heads, Die Sets Part number: PA3814 Package: RFQ verification required

Key Parameters

Part NumberPA3814
ManufacturerTempo Communications
CategoryCrimp Heads, Die Sets
seriesJack Terminatorâ„¢
packagingBulk
product statusObsolete
param 1Punch Head
param 2Modular Jacks
param 3-
param 4PA8100, PA8108
param 5Cat5e, Cat6

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify PA3814 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For PA3814, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.