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WAGO Corporation 60522733

SPLICE LEVR 24-12AWG 3POS

Answer first: this page is a purchasing reference for the exact part number 60522733 from WAGO Corporation. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: WAGO Corporation Part number: 60522733 Package: RFQ verification required

Key Parameters

Part Number60522733
ManufacturerWAGO Corporation
CategoryWire Splice Connectors
series-
packagingBag
product statusActive
param 1Butt Splice, Closed End, Individual Openings
param 23
param 3Push In
param 412-24 AWG
param 5Fully Insulated
param 6Releasable
param 7Transparent - Green

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 60522733 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 60522733, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.