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YAGEO BK32001002

GDT 200V 500A 3 POLE TH

Answer first: this page is a purchasing reference for the exact part number BK32001002 from YAGEO. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: YAGEO Category: Gas Discharge Tube Arresters (GDT) Part number: BK32001002 Package: Axial Cylinder RFQ verification required

Key Parameters

Part NumberBK32001002
ManufacturerYAGEO
CategoryGas Discharge Tube Arresters (GDT)
packageAxial Cylinder
seriesBK3
packagingCut Tape (CT)
product statusActive
param 1200 V
param 2500A
param 3±20%
param 43
param 5No
param 6Through Hole

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify BK32001002 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For BK32001002, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.