Photo | Mfr. Part # | Availability | Quantity | Datasheet | RoHs | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MVR5510AVMANEPR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
2,243 |
|
![]() Datasheet |
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- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MVR5510AVMALEPR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
2,692 |
|
![]() Datasheet |
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- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS6507LAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
1,811 |
|
![]() Datasheet |
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33PF8100FJESR2POWER MANAGEMENT IC, I.MX8, PRE- NXP USA Inc. |
1,817 |
|
![]() Datasheet |
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- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Processor | 10µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8100F3ESR2POWER MANAGEMENT IC, I.MX8, PRE- NXP USA Inc. |
2,575 |
|
![]() Datasheet |
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- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Processor | 10µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC34PF4210A2ESPF4210 NXP USA Inc. |
2,228 |
|
![]() Datasheet |
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- | 56-VFQFN Exposed Pad | Tray | Active | Audio, Video | - | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-QFN-EP (8x8) |
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MC34PF4210A4ESPF4210 NXP USA Inc. |
2,808 |
|
![]() Datasheet |
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- | 56-VFQFN Exposed Pad | Tray | Active | Audio, Video | - | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-QFN-EP (8x8) |
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MC34PF4210A3ESPF4210 NXP USA Inc. |
2,432 |
|
![]() Datasheet |
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- | 56-VFQFN Exposed Pad | Tray | Active | Audio, Video | - | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-QFN-EP (8x8) |
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MC35FS6516CAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
2,594 |
|
![]() Datasheet |
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- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MFS2623AMDA0ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
1,660 |
|
![]() Datasheet |
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- | 48-LQFP Exposed Pad | Tray | Active | - | - | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |