Headers, Male Pins

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Current Rating (Amps)
951268-7622-AR CONN HEADER R/A 68POS 2MM 3M	3,127	-	RFQ	Datasheet	951	Bulk	Active	Header	Male Pin	0.079" (2.00mm)	68	2	0.079" (2.00mm)	All	Board to Board	Unshrouded	Through Hole, Right Angle	Solder	Push-Pull	0.173" (4.40mm)	0.110" (2.79mm)	-	0.157" (4.00mm)	Square	Gold	Tin	Copper Alloy	Thermoplastic	-	1A
349-10-126-00-560000 CONN HEADER SMD 26POS 2.54MM Mill-Max Manufacturing Corp.	2,026	-	RFQ	-	349	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	26	1	-	All	Board to Board	Unshrouded	Surface Mount	Solder	Push-Pull	0.136" (3.45mm)	-	-	0.110" (2.79mm)	Circular	Gold	Gold	-	Polycyclohexylenedimethylene Terephthalate (PCT)	-	-
M80-5222642 CONN HEADER SMD 26POS 2MM Harwin Inc.	4,748	-	RFQ	Datasheet	Datamate J-Tek	Tube	Active	Header	Male Pin	0.079" (2.00mm)	26	2	0.079" (2.00mm)	All	Board to Board or Cable	Shrouded - 4 Wall	Surface Mount	Solder	Push-Pull	-	-	-	0.220" (5.60mm)	Circular	Gold	Tin	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	Keying Slot, Mating Flange	2.2A
802-80-070-66-001101 CONN HEADER VERT 70POS 2.54MM Preci-Dip	3,666	-	RFQ	Datasheet	802	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	70	2	0.100" (2.54mm)	All	Board to Board	Unshrouded	Through Hole	Press-Fit, Solder	Push-Pull	0.191" (4.85mm)	0.150" (3.81mm)	0.467" (11.85mm)	0.110" (2.79mm)	Circular	Tin	Tin	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-	3A
802-10-040-10-001000 CONN HEADER VERT 40POS 2.54MM Mill-Max Manufacturing Corp.	2,085	-	RFQ	Datasheet	802	Tube	Active	Header	Male Pin	0.100" (2.54mm)	40	2	0.100" (2.54mm)	All	Board to Board	Unshrouded	Through Hole	Solder	Push-Pull	0.195" (4.95mm)	0.118" (3.00mm)	0.438" (11.12mm)	0.110" (2.79mm)	Circular	Gold	Gold	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT)	-	-
TSM-120-01-S-DH-SL CONN HEADER SMD R/A 40POS 2.54MM Samtec Inc.	3,426	-	RFQ	Datasheet	TSM	Tube	Active	Header	Male Pin	0.100" (2.54mm)	40	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount, Right Angle	Solder	Push-Pull	0.230" (5.84mm)	-	-	0.240" (6.10mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Solder Retention	-
TSM-132-01-S-SH-A CONN HEADER SMD R/A 32POS 2.54MM Samtec Inc.	2,874	-	RFQ	Datasheet	TSM	Tube	Active	Header	Male Pin	0.100" (2.54mm)	32	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount, Right Angle	Solder	Push-Pull	0.230" (5.84mm)	-	-	0.120" (3.05mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Board Guide	-
TSM-135-05-L-DV-A CONN HEADER SMD 70POS 2.54MM Samtec Inc.	2,091	-	RFQ	Datasheet	TSM	Tube	Active	Header, Cuttable	Male Pin	0.100" (2.54mm)	70	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.075" (1.90mm)	-	-	0.100" (2.54mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Board Guide	-
TSM-137-03-L-DV CONN HEADER SMD 74POS 2.54MM Samtec Inc.	2,835	-	RFQ	Datasheet	TSM	Tube	Active	Header, Cuttable	Male Pin	0.100" (2.54mm)	74	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.420" (10.67mm)	-	-	0.100" (2.54mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-
IPL1-110-02-L-D-P CONN HEADER SMD 20POS 2.54MM Samtec Inc.	2,899	-	RFQ	-	Mini Mate® IPL1	Tube	Active	Header	Male Pin	0.100" (2.54mm)	20	2	0.100" (2.54mm)	All	Board to Cable/Wire	Shrouded - 4 Wall	Surface Mount	Solder	Locking Ramp	0.215" (5.46mm)	-	-	0.320" (8.13mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-
IPL1-110-02-LM-D-P CONN HEADER SMD 20POS 2.54MM Samtec Inc.	3,990	-	RFQ	-	Mini Mate® IPL1	Tube	Active	Header	Male Pin	0.100" (2.54mm)	20	2	0.100" (2.54mm)	All	Board to Cable/Wire	Shrouded - 4 Wall	Surface Mount	Solder	Locking Ramp	0.215" (5.46mm)	-	-	0.320" (8.13mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-
HTSW-120-05-H-D CONN HEADER VERT 40POS 2.54MM Samtec Inc.	3,254	-	RFQ	-	HTSW	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	40	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.105" (2.67mm)	0.130" (3.30mm)	0.335" (8.51mm)	0.100" (2.54mm)	Square	Gold	Gold	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	Varies by Wire Gauge
TMMH-130-01-F-DV-ES-M 2MM LOW PROFILE STRIPS Samtec Inc.	2,299	-	RFQ	-	TMMH	Bulk	Active	Header, Cuttable	Male Pin	0.079" (2.00mm)	60	2	0.079" (2.00mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.126" (3.20mm)	-	-	0.079" (2.00mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	End Shrouds, Pick and Place	-
HTSS-130-01-F-D CONN HEADER VERT 60POS 2.54MM Samtec Inc.	2,734	-	RFQ	-	Flex Stack, HTSS	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	60	2	0.100" (2.54mm)	All	Board to Board or Cable	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.250" (6.35mm)	0.115" (2.92mm)	0.480" (12.19mm)	0.350" (8.89mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Keying Slot	-
MTMM-150-08-L-S-157 VARIABLE POST HEIGHT HEADER STRI Samtec Inc.	4,773	-	RFQ	Datasheet	MTMM	Bulk	Active	Header, Cuttable	Male Pin	0.079" (2.00mm)	50	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.157" (4.00mm)	0.260" (6.60mm)	0.476" (12.09mm)	0.059" (1.50mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	3A
HFWS-20-04-TM-S-RA .200" HIGH-TEMP POWER TERMINAL S Samtec Inc.	4,665	-	RFQ	Datasheet	HFWS	Bulk	Active	Header	Male Pin	0.200" (5.08mm)	20	1	-	All	Board to Board	Unshrouded	Through Hole, Right Angle	Solder	Push-Pull	0.544" (13.82mm)	0.156" (3.96mm)	-	0.100" (2.54mm)	Square	Tin	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	11.4A per Contact
IPL1-115-02-STL-D-K .100" MINI MATE ISOLATED POWER T Samtec Inc.	4,007	-	RFQ	Datasheet	Mini Mate® IPL1	Tube	Active	Header	Male Pin	0.100" (2.54mm)	30	2	0.100" (2.54mm)	All	Board to Cable/Wire	Shrouded - 4 Wall	Surface Mount	Solder	Locking Ramp	0.215" (5.46mm)	-	-	0.320" (8.13mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-
ZLTMM-113-69-G-D-470 2.00 MM SHROUDED VARIABLE STACK Samtec Inc.	4,040	-	RFQ	Datasheet	Flex Stack, ZLTMM	Bulk	Active	Header, Elevated	Male Pin	0.079" (2.00mm)	26	2	0.079" (2.00mm)	All	Board to Board	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.120" (3.05mm)	-	0.614" (15.60mm)	0.470" (11.94mm)	Square	Gold	Gold	Phosphor Bronze	Polyamide (PA), Nylon	Keying Slot	-
ZLTMM-113-69-G-D-370 2.00 MM SHROUDED VARIABLE STACK Samtec Inc.	3,179	-	RFQ	Datasheet	Flex Stack, ZLTMM	Bulk	Active	Header, Elevated	Male Pin	0.079" (2.00mm)	26	2	0.079" (2.00mm)	All	Board to Board	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.120" (3.05mm)	-	0.614" (15.60mm)	0.370" (9.40mm)	Square	Gold	Gold	Phosphor Bronze	Polyamide (PA), Nylon	Keying Slot	-
TML-115-01-G-D-SM .050" X .100" SHROUDED TERMINAL Samtec Inc.	4,774	-	RFQ	Datasheet	TML	Tube	Active	Header	Male Pin	0.050" (1.27mm)	30	2	0.100" (2.54mm)	All	Board to Board	Shrouded - 4 Wall	Surface Mount	Solder	Push-Pull	0.120" (3.05mm)	-	-	0.380" (9.65mm)	Square	Gold	Gold	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Keying Slot	-

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