Headers, Male Pins

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Current Rating (Amps)
IPT1-102-01-S-D-PL CONN HEADER VERT 4POS 2.54MM Samtec Inc.	3,093	-	RFQ	-	Mini Mate® IPT1	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	4	2	0.100" (2.54mm)	3	Board to Board	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.155" (3.94mm)	0.085" (2.16mm)	0.335" (8.51mm)	0.250" (6.35mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	2.3A per Contact
IPT1-107-03-L-D CONN HEADER VERT 14POS 2.54MM Samtec Inc.	2,994	-	RFQ	-	Mini Mate® IPT1	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	14	2	0.100" (2.54mm)	All	Board to Board	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.155" (3.94mm)	0.085" (2.16mm)	0.530" (13.46mm)	0.445" (11.30mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	2.3A per Contact
IPT1-120-01-S-D-FL CONN HEADER VERT 40POS 2.54MM Samtec Inc.	3,692	-	RFQ	-	Mini Mate® IPT1	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	40	2	0.100" (2.54mm)	All	Board to Board	Shrouded - 4 Wall	Through Hole	Solder	Friction Lock	0.155" (3.94mm)	0.085" (2.16mm)	0.335" (8.51mm)	0.250" (6.35mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	2.3A per Contact
TST-104-01-L-D-LL CONN HEADER VERT 8POS 2.54MM Samtec Inc.	4,478	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	8	2	0.100" (2.54mm)	All	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole	Kinked Pin, Solder	Push-Pull	0.250" (6.35mm)	0.115" (2.92mm)	0.480" (12.19mm)	0.350" (8.89mm)	Square	Gold	Tin	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
TST-105-01-G-D-02 CONN HEADER VERT 10POS 2.54MM Samtec Inc.	3,317	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	10	2	0.100" (2.54mm)	9	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.250" (6.35mm)	0.115" (2.92mm)	0.480" (12.19mm)	0.350" (8.89mm)	Square	Gold	Gold	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
TST-105-01-T-D-05 CONN HEADER VERT 10POS 2.54MM Samtec Inc.	4,149	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	10	2	0.100" (2.54mm)	9	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.250" (6.35mm)	0.115" (2.92mm)	0.480" (12.19mm)	0.350" (8.89mm)	Square	Tin	Tin	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
TST-107-02-T-S CONN HEADER VERT 7POS 2.54MM Samtec Inc.	2,795	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	7	1	-	All	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.250" (6.35mm)	0.165" (4.19mm)	0.530" (13.46mm)	0.350" (8.89mm)	Square	Tin	Tin	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
TST-110-01-G-D-LL-01 CONN HEADER VERT 20POS 2.54MM Samtec Inc.	2,526	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	20	2	0.100" (2.54mm)	19	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole	Kinked Pin, Solder	Push-Pull	0.250" (6.35mm)	0.115" (2.92mm)	0.480" (12.19mm)	0.350" (8.89mm)	Square	Gold	Gold	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
TST-110-04-G-D-RA-01 CONN HEADER R/A 20POS 2.54MM Samtec Inc.	2,243	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	20	2	0.100" (2.54mm)	19	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole, Right Angle	Solder	Push-Pull	0.250" (6.35mm)	0.130" (3.30mm)	-	0.365" (9.27mm)	Square	Gold	Gold	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
TST-113-04-S-D-RA-06 CONN HEADER R/A 26POS 2.54MM Samtec Inc.	4,637	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	26	2	0.100" (2.54mm)	25	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole, Right Angle	Solder	Push-Pull	0.250" (6.35mm)	0.130" (3.30mm)	-	0.365" (9.27mm)	Square	Gold	Tin	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
TST-120-01-L-D-10 CONN HEADER VERT 40POS 2.54MM Samtec Inc.	2,460	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	40	2	0.100" (2.54mm)	39	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.250" (6.35mm)	0.115" (2.92mm)	0.480" (12.19mm)	0.350" (8.89mm)	Square	Gold	Tin	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
TST-130-03-F-S CONN HEADER VERT 30POS 2.54MM Samtec Inc.	2,388	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	30	1	-	All	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.250" (6.35mm)	0.565" (14.35mm)	0.930" (23.62mm)	0.350" (8.89mm)	Square	Gold	Tin	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
TST-132-01-G-D-31 CONN HEADER VERT 64POS 2.54MM Samtec Inc.	2,557	-	RFQ	-	Flex Stack, TST	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	64	2	0.100" (2.54mm)	63	Board to Cable/Wire	Shrouded - 4 Wall	Through Hole	Solder	Push-Pull	0.250" (6.35mm)	0.115" (2.92mm)	0.480" (12.19mm)	0.350" (8.89mm)	Square	Gold	Gold	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	Keying Slot	3.4A per Contact
MTLW-101-05-G-D-027 CONN HEADER THROUGH HOLE 2POS Samtec Inc.	3,622	-	RFQ	-	Flex Stack, MTLW	Bulk	Active	Header	Male Pin	-	2	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.027" (0.69mm)	0.248" (6.30mm)	0.335" (8.51mm)	0.060" (1.52mm)	Square	Gold	Gold	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	5.2A per Contact
MTLW-101-08-G-S-031 CONN HEADER THROUGH HOLE 1POS Samtec Inc.	2,439	-	RFQ	-	Flex Stack, MTLW	Bulk	Active	Header	Male Pin	-	1	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.031" (0.79mm)	0.439" (11.15mm)	0.530" (13.46mm)	0.060" (1.52mm)	Square	Gold	Gold	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	5.2A per Contact
MTLW-102-05-F-S-169 CONN HEADER VERT 2POS 2.54MM Samtec Inc.	2,327	-	RFQ	-	Flex Stack, MTLW	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	2	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.169" (4.30mm)	0.106" (2.69mm)	0.335" (8.51mm)	0.060" (1.52mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	5.2A per Contact
MTLW-102-05-T-S-050 CONN HEADER VERT 2POS 2.54MM Samtec Inc.	2,318	-	RFQ	-	Flex Stack, MTLW	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	2	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.050" (1.27mm)	0.225" (5.72mm)	0.335" (8.51mm)	0.060" (1.52mm)	Square	Tin	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	5.2A per Contact
MTLW-102-05-T-S-061 CONN HEADER VERT 2POS 2.54MM Samtec Inc.	2,611	-	RFQ	-	Flex Stack, MTLW	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	2	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.061" (1.55mm)	0.214" (5.44mm)	0.335" (8.51mm)	0.060" (1.52mm)	Square	Tin	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	5.2A per Contact
MTLW-102-07-F-D-280 CONN HEADER VERT 4POS 2.54MM Samtec Inc.	4,098	-	RFQ	-	Flex Stack, MTLW	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	4	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.280" (7.11mm)	0.090" (2.29mm)	0.430" (10.92mm)	0.060" (1.52mm)	Square	Gold	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	5.2A per Contact
MTLW-102-07-T-S-232 CONN HEADER VERT 2POS 2.54MM Samtec Inc.	4,661	-	RFQ	-	Flex Stack, MTLW	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	2	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.232" (5.90mm)	0.138" (3.50mm)	0.430" (10.92mm)	0.060" (1.52mm)	Square	Tin	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	5.2A per Contact

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