Headers, Male Pins

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Current Rating (Amps)
SLV W 1 SMD 048 4 Z one row, wide isolation body, 4- Fischer Elektronik	2,157	-	RFQ	Datasheet	SLV W 1 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	4	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 66 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,724	-	RFQ	Datasheet	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	66	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 080 56 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,148	-	RFQ	Datasheet	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	56	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 66 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,571	-	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	66	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 10 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,410	-	RFQ	Datasheet	SLV W 2 130	Tube	Active	Header	Male Pin	0.050" (1.27mm)	10	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 055 26 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,335	-	RFQ	Datasheet	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	26	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 054 4 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,444	-	RFQ	Datasheet	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	4	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 055 42 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,215	-	RFQ	Datasheet	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	42	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 073 16 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	3,744	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	16	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 055 68 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,077	-	RFQ	Datasheet	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	68	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 SMD 048 36 Z one row, wide isolation body, 4- Fischer Elektronik	4,152	-	RFQ	Datasheet	SLV W 1 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 105 46 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,530	-	RFQ	Datasheet	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	46	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 036 56 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,195	-	RFQ	Datasheet	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	56	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 105 70 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,385	-	RFQ	Datasheet	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	70	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 44 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,339	-	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	44	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 26 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,540	-	RFQ	Datasheet	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	26	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 SMD 048 28 Z one row, wide isolation body, 4- Fischer Elektronik	3,682	-	RFQ	Datasheet	SLV W 1 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 054 30 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,793	-	RFQ	Datasheet	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	30	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 SMD 073 36 G one row, wide isolation body, 4- Fischer Elektronik	3,918	-	RFQ	Datasheet	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 22 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,211	-	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	22	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A

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