Headers, Male Pins

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Current Rating (Amps)
SLV W 2 SMD 073 28 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,452	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 080 38 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,362	-	RFQ	Datasheet	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	38	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 SMD 048 12 G one row, wide isolation body, 4- Fischer Elektronik	2,450	-	RFQ	Datasheet	SLV W 1 SMD 048	-	Active	Header	Male Pin	0.050" (1.27mm)	12	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 16 G SM one row expanded insulator 2-20 Fischer Elektronik	3,165	-	RFQ	Datasheet	SLV W 3 SMD 048	Tube	Active	Header	Male Pin	0.050" (1.27mm)	16	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 26 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	3,475	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	26	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 44 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,879	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	44	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 KA 055 10 Z suitable for female header BLM Fischer Elektronik	4,969	-	RFQ	Datasheet	SLV W 1 KA 055	-	Active	Header	Male Pin	0.050" (1.27mm)	10	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 130 29 Z suitable for female header BLM Fischer Elektronik	2,212	-	RFQ	Datasheet	SLV W 1 130	-	Active	Header	Male Pin	0.050" (1.27mm)	29	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 105 64 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,151	-	RFQ	Datasheet	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	64	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 40 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	4,117	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	40	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 105 34 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,133	-	RFQ	Datasheet	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	34	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 127 12 G one row, wide isolation body, 4- Fischer Elektronik	4,313	-	RFQ	Datasheet	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	12	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 11 SMD 127 36 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	4,167	-	RFQ	Datasheet	SLV W 11 SMD 127	-	Active	Header	Male Pin	0.050" (1.27mm)	36	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 073 36 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,897	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 58 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,982	-	RFQ	Datasheet	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	58	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 127 11 Z one row, wide isolation body, 4- Fischer Elektronik	4,218	-	RFQ	Datasheet	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	11	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 055 62 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,145	-	RFQ	Datasheet	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	62	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 4 036 44 Z two rows 4-72 contacts Fischer Elektronik	3,071	-	RFQ	Datasheet	SLV W 4 036	-	Active	Header	Male Pin	0.050" (1.27mm)	44	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 24 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,921	-	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	24	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 102 10 Z one row, wide isolation body, 4- Fischer Elektronik	2,391	-	RFQ	Datasheet	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	10	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A

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