Headers, Male Pins

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Current Rating (Amps)
SLV W 9 SMD 102 7 Z one row, wide isolation body, 4- Fischer Elektronik	3,093	-	RFQ	Datasheet	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	7	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 127 10 Z one row, wide isolation body, 4- Fischer Elektronik	3,747	-	RFQ	Datasheet	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	10	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 102 28 Z one row, wide isolation body, 4- Fischer Elektronik	4,454	-	RFQ	Datasheet	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 080 6 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,034	-	RFQ	Datasheet	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	6	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 073 6 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,803	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	6	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 72 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,913	-	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	72	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 10 G SM one row expanded insulator 2-20 Fischer Elektronik	4,157	-	RFQ	Datasheet	SLV W 3 SMD 048	Tube	Active	Header	Male Pin	0.050" (1.27mm)	10	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 4 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,048	-	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	4	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 073 20 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,769	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	20	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 18 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,698	-	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	18	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 19 G SM one row expanded insulator 2-20 Fischer Elektronik	3,183	-	RFQ	Datasheet	SLV W 3 SMD 048	Tube	Active	Header	Male Pin	0.050" (1.27mm)	19	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 14 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,821	-	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	14	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 11 SMD 102 72 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,556	-	RFQ	Datasheet	SLV W 11 SMD 102	-	Active	Header	Male Pin	0.050" (1.27mm)	72	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 KA 030 14 G suitable for female header BLM Fischer Elektronik	2,315	-	RFQ	Datasheet	SLV W 1 KA 030	-	Active	Header	Male Pin	0.050" (1.27mm)	14	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 127 19 G one row, wide isolation body, 4- Fischer Elektronik	4,906	-	RFQ	Datasheet	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	19	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 14 Z SM one row expanded insulator 2-20 Fischer Elektronik	3,589	-	RFQ	Datasheet	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	14	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 054 18 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,227	-	RFQ	Datasheet	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	18	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 073 70 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,366	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	70	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 70 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,150	-	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	70	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 56 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,650	-	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	56	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A

Total 336228 Record«Prev 1... 15003 15004 15005 150061500715008 15009 15010...16812 Next»

HOME

PRODUCT

PHONE

USER

[email protected]