| Photo | Mfr. Part # | Availability | Quantity | Datasheet | RoHs | Series | Packaging | Product Status | Connector Type | Contact Type | Style | Number of Positions | Number of Positions Loaded | Pitch - Mating | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Finish - Mating | Contact Finish Thickness - Mating | Insulation Color | Insulation Height | Contact Length - Post | Operating Temperature | Material Flammability Rating | Mated Stacking Heights | Ingress Protection | Features | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ESQT-115-02-GF-D-310CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
3,411 |
|
- |
ESQT | Bulk | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.310" (7.87mm) | 0.540" (13.72mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | |
|
ESQT-115-02-GF-D-365CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
2,287 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.365" (9.27mm) | 0.485" (12.32mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | |
|
ESQT-115-02-GF-D-375CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
2,200 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.375" (9.53mm) | 0.475" (12.07mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | |
|
ESQT-115-02-GF-D-650CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
2,139 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.650" (16.50mm) | 0.200" (5.08mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | |
|
ESQT-115-02-GF-D-740CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
2,096 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.740" (18.80mm) | 0.110" (2.79mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | |
|
ESQT-115-02-GF-D-760CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
2,061 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.760" (19.30mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | |
|
ESQT-115-02-GF-D-730FLEXYZ FLEXIBLE-HEIGHT SOCKET ST Samtec Inc. |
2,016 |
|
Datasheet |
ESQT | Bulk | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.730" (18.54mm) | 0.120" (3.05mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | |
|
ESQT-115-02-GF-D-725FLEXYZ FLEXIBLE-HEIGHT SOCKET ST Samtec Inc. |
4,895 |
|
Datasheet |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.725" (18.42mm) | 0.125" (3.18mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | |
|
ESQT-115-02-GF-D-368FLEXYZ FLEXIBLE-HEIGHT SOCKET ST Samtec Inc. |
4,433 |
|
Datasheet |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.368" (9.35mm) | 0.482" (12.24mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact | |
|
CLP-113-02-H-DLOW PROFILE DUAL-WIPE SOCKET, 0. Samtec Inc. |
2,479 |
|
Datasheet |
CLP | Tube | Active | Receptacle | Female Socket | Board to Board | 26 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact |