Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    SIP1X17-001B

    SIP1X17-001B

    SIP1X17-001B-SIP SOCKET 17 CTS

    Amphenol ICC (FCI)

    3,773
    RFQ
    SIP1X17-001B

    Datasheet

    SIP1X17-001B SIP1x Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    04-0513-11

    04-0513-11

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    4,839
    RFQ
    04-0513-11

    Datasheet

    04-0513-11 0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    2-382714-1

    2-382714-1

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    4,874
    RFQ
    2-382714-1

    Datasheet

    2-382714-1 Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    1051631001

    1051631001

    SMIA65 CAMERA SOCKET CONTACT

    Molex

    4,855
    RFQ
    1051631001

    Datasheet

    1051631001 105163 Tape & Reel (TR) Obsolete Camera Socket 12 (2 x 6) 0.037" (0.95mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.037" (0.95mm) Gold Flash Copper Alloy Thermoplastic -55°C ~ 85°C
    1051900001

    1051900001

    TOP-MOUNT CAMERA SOCKET FOR SMIA

    Molex

    4,652
    RFQ
    1051900001

    Datasheet

    1051900001 105190 Tape & Reel (TR) Obsolete Camera Socket 12 (2 x 6) 0.033" (0.85mm) Gold 12.0µin (0.30µm) Phosphor Bronze Alloy Surface Mount Open Frame Solder 0.033" (0.85mm) Gold Flash Phosphor Bronze Alloy Thermoplastic -55°C ~ 85°C
    540-88-032-17-400

    540-88-032-17-400

    CONN SOCKET PLCC 32POS TIN

    Preci-Dip

    3,698
    RFQ
    540-88-032-17-400

    Datasheet

    540-88-032-17-400 540 Bulk Active PLCC 32 (4 x 8) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    808-AG11D-ESL-LF

    808-AG11D-ESL-LF

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    2,532
    RFQ
    808-AG11D-ESL-LF

    Datasheet

    808-AG11D-ESL-LF 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    116-83-306-41-007101

    116-83-306-41-007101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,566
    RFQ
    116-83-306-41-007101

    Datasheet

    116-83-306-41-007101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-316-41-003101

    115-87-316-41-003101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,235
    RFQ
    115-87-316-41-003101

    Datasheet

    115-87-316-41-003101 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 24 HGL-TT

    AR 24 HGL-TT

    SOCKET

    Assmann WSW Components

    3,474
    RFQ

    -

    AR 24 HGL-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 24 HGL/7-TT

    AR 24 HGL/7-TT

    SOCKET

    Assmann WSW Components

    2,669
    RFQ

    -

    AR 24 HGL/7-TT AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-87-320-41-005101

    110-87-320-41-005101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,919
    RFQ
    110-87-320-41-005101

    Datasheet

    110-87-320-41-005101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-320-41-605101

    110-87-320-41-605101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,588
    RFQ
    110-87-320-41-605101

    Datasheet

    110-87-320-41-605101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    233-84

    233-84

    CONN SOCKET PLCC 84POS TIN

    CNC Tech

    4,184
    RFQ
    233-84

    Datasheet

    233-84 - Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    3-382568-2

    3-382568-2

    CONN IC DIP SOCKET 32POS TIN

    TE Connectivity AMP Connectors

    2,159
    RFQ
    3-382568-2

    Datasheet

    3-382568-2 Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    614-83-308-31-012101

    614-83-308-31-012101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,240
    RFQ
    614-83-308-31-012101

    Datasheet

    614-83-308-31-012101 614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-308-41-134191

    114-83-308-41-134191

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,722
    RFQ
    114-83-308-41-134191

    Datasheet

    114-83-308-41-134191 114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A22-LCG-T-R

    A22-LCG-T-R

    CONN IC DIP SOCKET 22POS GOLD

    Assmann WSW Components

    4,890
    RFQ
    A22-LCG-T-R

    Datasheet

    A22-LCG-T-R - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    SIP050-1X10-160B

    SIP050-1X10-160B

    1X10-160B-SIP SOCKET 10 CTS

    Amphenol ICC (FCI)

    2,285
    RFQ
    SIP050-1X10-160B

    Datasheet

    SIP050-1X10-160B SIP050-1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SU1210200000G

    SU1210200000G

    SU-2*6P RED ; 10.0MM CLIP PLATI

    Amphenol Anytek

    3,754
    RFQ

    -

    SU1210200000G SU Bulk Active DIP, 0.1" (2.54mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
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