Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-87-314-31-012101

    614-87-314-31-012101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,776
    RFQ
    614-87-314-31-012101

    Datasheet

    614-87-314-31-012101 614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0513-10H

    05-0513-10H

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    3,122
    RFQ
    05-0513-10H

    Datasheet

    05-0513-10H 0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-87-624-41-005101

    110-87-624-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,279
    RFQ
    110-87-624-41-005101

    Datasheet

    110-87-624-41-005101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-624-41-605101

    110-87-624-41-605101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,027
    RFQ
    110-87-624-41-605101

    Datasheet

    110-87-624-41-605101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR48-HZL-TT

    AR48-HZL-TT

    CONN IC DIP SOCKET 48POS TIN

    Assmann WSW Components

    3,301
    RFQ
    AR48-HZL-TT

    Datasheet

    AR48-HZL-TT - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A-CCS52-G

    A-CCS52-G

    CONN SOCKET PLCC 52POS GOLD

    Assmann WSW Components

    2,421
    RFQ
    A-CCS52-G

    Datasheet

    A-CCS52-G - Bag Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    612-87-316-41-001101

    612-87-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,201
    RFQ
    612-87-316-41-001101

    Datasheet

    612-87-316-41-001101 612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-308-41-011101

    116-87-308-41-011101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,745
    RFQ
    116-87-308-41-011101

    Datasheet

    116-87-308-41-011101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-322-41-001101

    115-87-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,121
    RFQ

    -

    115-87-322-41-001101 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 52-HGL-TT

    AR 52-HGL-TT

    SOCKET

    Assmann WSW Components

    4,369
    RFQ

    -

    AR 52-HGL-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    06-6513-10

    06-6513-10

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,484
    RFQ
    06-6513-10

    Datasheet

    06-6513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-3513-10T

    08-3513-10T

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,311
    RFQ
    08-3513-10T

    Datasheet

    08-3513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6513-10T

    08-6513-10T

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,107
    RFQ
    08-6513-10T

    Datasheet

    08-6513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    07-0518-00

    07-0518-00

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    3,597
    RFQ
    07-0518-00

    Datasheet

    07-0518-00 518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0518-10T

    11-0518-10T

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,666
    RFQ
    11-0518-10T

    Datasheet

    11-0518-10T 518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ED068PLCZ-SM-N

    ED068PLCZ-SM-N

    CONN SOCKET PLCC 68POS

    On Shore Technology Inc.

    2,540
    RFQ
    ED068PLCZ-SM-N

    Datasheet

    ED068PLCZ-SM-N ED Tube Active PLCC 68 (2 x 34) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
    A-CCS68-G

    A-CCS68-G

    CONN SOCKET PLCC 68POS GOLD

    Assmann WSW Components

    2,702
    RFQ
    A-CCS68-G

    Datasheet

    A-CCS68-G - Bag Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    1-1437535-9

    1-1437535-9

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    3,888
    RFQ
    1-1437535-9

    Datasheet

    1-1437535-9 500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass - -55°C ~ 105°C
    A28-LCG-T-R

    A28-LCG-T-R

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    3,336
    RFQ
    A28-LCG-T-R

    Datasheet

    A28-LCG-T-R - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    506-AG12D-LF

    506-AG12D-LF

    CONN IC DIP SOCKET 6POS TIN

    TE Connectivity AMP Connectors

    3,017
    RFQ
    506-AG12D-LF

    Datasheet

    506-AG12D-LF 500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
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