Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    10-0518-11

    10-0518-11

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    4,340
    RFQ
    10-0518-11

    Datasheet

    10-0518-11 518 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-1518-11

    10-1518-11

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,849
    RFQ
    10-1518-11

    Datasheet

    10-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0517-90C

    04-0517-90C

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    4,226
    RFQ
    04-0517-90C

    Datasheet

    04-0517-90C 0517 Bulk Active SIP 4 (1 x 4) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-308-41-004101

    116-87-308-41-004101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,583
    RFQ
    116-87-308-41-004101

    Datasheet

    116-87-308-41-004101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-324-41-134161

    114-87-324-41-134161

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,239
    RFQ
    114-87-324-41-134161

    Datasheet

    114-87-324-41-134161 114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-628-41-005101

    110-87-628-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,444
    RFQ
    110-87-628-41-005101

    Datasheet

    110-87-628-41-005101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1571552-6

    1571552-6

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    4,502
    RFQ
    1571552-6

    Datasheet

    1571552-6 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    299-87-306-11-001101

    299-87-306-11-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,182
    RFQ
    299-87-306-11-001101

    Datasheet

    299-87-306-11-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    808-AG10D-ES

    808-AG10D-ES

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    2,403
    RFQ
    808-AG10D-ES

    Datasheet

    808-AG10D-ES 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    06-3518-10M

    06-3518-10M

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,466
    RFQ
    06-3518-10M

    Datasheet

    06-3518-10M 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    146-87-312-41-035101

    146-87-312-41-035101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    2,123
    RFQ
    146-87-312-41-035101

    Datasheet

    146-87-312-41-035101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-312-41-036101

    146-87-312-41-036101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,214
    RFQ
    146-87-312-41-036101

    Datasheet

    146-87-312-41-036101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP640-011B

    DIP640-011B

    DIP640-011B-DIP SOCKET 40 CTS

    Amphenol ICC (FCI)

    3,703
    RFQ
    DIP640-011B

    Datasheet

    DIP640-011B - Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR 18-HZL/07-TT

    AR 18-HZL/07-TT

    CONN IC DIP SOCKET 18POS GOLD

    Assmann WSW Components

    3,874
    RFQ
    AR 18-HZL/07-TT

    Datasheet

    AR 18-HZL/07-TT - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    7-1437539-7

    7-1437539-7

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    3,259
    RFQ
    7-1437539-7

    Datasheet

    7-1437539-7 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    410-87-224-10-002101

    410-87-224-10-002101

    CONN ZIG-ZAG 24POS GOLD

    Preci-Dip

    2,674
    RFQ
    410-87-224-10-002101

    Datasheet

    410-87-224-10-002101 410 Bulk Active Zig-Zag, Right Stackable 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    7-1437535-0

    7-1437535-0

    CONN SOCKET SIP 14POS GOLD

    TE Connectivity AMP Connectors

    4,591
    RFQ

    -

    7-1437535-0 - Bulk Obsolete SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 10.0µin (0.25µm) Beryllium Copper Polyester -55°C ~ 125°C
    116-87-610-41-001101

    116-87-610-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,936
    RFQ
    116-87-610-41-001101

    Datasheet

    116-87-610-41-001101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1571550-2

    1571550-2

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    3,907
    RFQ
    1571550-2

    Datasheet

    1571550-2 500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    510-87-032-09-041101

    510-87-032-09-041101

    CONN SOCKET PGA 32POS GOLD

    Preci-Dip

    2,728
    RFQ
    510-87-032-09-041101

    Datasheet

    510-87-032-09-041101 510 Bulk Active PGA 32 (9 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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