Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    115-87-328-41-001101

    115-87-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,238
    RFQ

    -

    115-87-328-41-001101 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-3518-10T

    24-3518-10T

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,468
    RFQ
    24-3518-10T

    Datasheet

    24-3518-10T 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    917-87-108-41-005101

    917-87-108-41-005101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    2,624
    RFQ
    917-87-108-41-005101

    Datasheet

    917-87-108-41-005101 917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-87-208-41-005101

    917-87-208-41-005101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    3,713
    RFQ
    917-87-208-41-005101

    Datasheet

    917-87-208-41-005101 917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-318-31-012101

    614-87-318-31-012101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,696
    RFQ
    614-87-318-31-012101

    Datasheet

    614-87-318-31-012101 614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-007101

    116-87-314-41-007101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,338
    RFQ
    116-87-314-41-007101

    Datasheet

    116-87-314-41-007101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A 28-LC-TR01

    A 28-LC-TR01

    28 (2 X 14) POS DIP, 0.3" (7.62M

    Assmann WSW Components

    3,605
    RFQ
    A 28-LC-TR01

    Datasheet

    A 28-LC-TR01 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    08-6513-11

    08-6513-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,012
    RFQ
    08-6513-11

    Datasheet

    08-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    A-ICS-254-10-TT50

    A-ICS-254-10-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    2,244
    RFQ
    A-ICS-254-10-TT50

    Datasheet

    A-ICS-254-10-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    08-3518-10H

    08-3518-10H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,181
    RFQ
    08-3518-10H

    Datasheet

    08-3518-10H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    D01-9950942

    D01-9950942

    CONN SOCKET SIP 9POS GOLD

    Harwin Inc.

    4,172
    RFQ
    D01-9950942

    Datasheet

    D01-9950942 D01-995 Tube Obsolete SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-6513-10

    02-6513-10

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    3,322
    RFQ
    02-6513-10

    Datasheet

    02-6513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-87-320-41-105161

    110-87-320-41-105161

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,091
    RFQ
    110-87-320-41-105161

    Datasheet

    110-87-320-41-105161 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D0814-01

    D0814-01

    CONN IC DIP SOCKET 14POS GOLD

    Harwin Inc.

    4,486
    RFQ
    D0814-01

    Datasheet

    D0814-01 D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-324-41-117101

    114-87-324-41-117101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,163
    RFQ
    114-87-324-41-117101

    Datasheet

    114-87-324-41-117101 114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-432-41-005101

    110-87-432-41-005101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,354
    RFQ
    110-87-432-41-005101

    Datasheet

    110-87-432-41-005101 110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-428-41-001101

    115-87-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,283
    RFQ

    -

    115-87-428-41-001101 115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-610-41-011101

    116-87-610-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,352
    RFQ
    116-87-610-41-011101

    Datasheet

    116-87-610-41-011101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-306-41-013101

    116-87-306-41-013101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,911
    RFQ
    116-87-306-41-013101

    Datasheet

    116-87-306-41-013101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    11-0518-11

    11-0518-11

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,500
    RFQ
    11-0518-11

    Datasheet

    11-0518-11 518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 136137138139140141142143...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER