Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    16-3518-10E

    16-3518-10E

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,971
    RFQ
    16-3518-10E

    Datasheet

    16-3518-10E 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-2503-21

    08-2503-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,279
    RFQ
    08-2503-21

    Datasheet

    08-2503-21 503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-0511-10

    32-0511-10

    CONN SOCKET SIP 32POS TIN

    Aries Electronics

    2,291
    RFQ
    32-0511-10

    Datasheet

    32-0511-10 511 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-0518-00

    36-0518-00

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    2,368
    RFQ
    36-0518-00

    Datasheet

    36-0518-00 518 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    36-1518-00

    36-1518-00

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,967
    RFQ
    36-1518-00

    Datasheet

    36-1518-00 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-3501-21

    16-3501-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,586
    RFQ
    16-3501-21

    Datasheet

    16-3501-21 501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-3501-31

    16-3501-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,921
    RFQ
    16-3501-31

    Datasheet

    16-3501-31 501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-0511-10

    28-0511-10

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    3,848
    RFQ
    28-0511-10

    Datasheet

    28-0511-10 511 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-C182-10H

    24-C182-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,476
    RFQ
    24-C182-10H

    Datasheet

    24-C182-10H EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6810-90T

    08-6810-90T

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    4,835
    RFQ
    08-6810-90T

    Datasheet

    08-6810-90T Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
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