Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    40-6513-11

    40-6513-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,955
    RFQ
    40-6513-11

    Datasheet

    40-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    37-0518-11H

    37-0518-11H

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    4,553
    RFQ
    37-0518-11H

    Datasheet

    37-0518-11H 518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-810-90RWR

    14-810-90RWR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,912
    RFQ
    14-810-90RWR

    Datasheet

    14-810-90RWR Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    28-3518-111

    28-3518-111

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,168
    RFQ
    28-3518-111

    Datasheet

    28-3518-111 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6518-111

    28-6518-111

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,511
    RFQ
    28-6518-111

    Datasheet

    28-6518-111 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-0503-21

    12-0503-21

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    2,964
    RFQ
    12-0503-21

    Datasheet

    12-0503-21 0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    12-0503-31

    12-0503-31

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    2,249
    RFQ
    12-0503-31

    Datasheet

    12-0503-31 0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    10-6511-11

    10-6511-11

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,992
    RFQ
    10-6511-11

    Datasheet

    10-6511-11 511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-9513-11H

    10-9513-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,941
    RFQ
    10-9513-11H

    Datasheet

    10-9513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6518-102

    32-6518-102

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,733
    RFQ
    32-6518-102

    Datasheet

    32-6518-102 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 4131 Record«Prev1... 154155156157158159160161...414Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER