Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    13-0508-21

    13-0508-21

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    3,402
    RFQ
    13-0508-21

    Datasheet

    13-0508-21 508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    13-0508-31

    13-0508-31

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    3,458
    RFQ
    13-0508-31

    Datasheet

    13-0508-31 508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    18-3508-301

    18-3508-301

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,085
    RFQ
    18-3508-301

    Datasheet

    18-3508-301 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6823-90

    14-6823-90

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,049
    RFQ
    14-6823-90

    Datasheet

    14-6823-90 Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    16-820-90T

    16-820-90T

    RT ANGLE 16 PIN SKT .1 INCH CTR

    Aries Electronics

    3,451
    RFQ

    -

    16-820-90T Vertisockets™ 800 - Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 105°C
    28-3518-112

    28-3518-112

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,298
    RFQ
    28-3518-112

    Datasheet

    28-3518-112 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6518-112

    28-6518-112

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,136
    RFQ
    28-6518-112

    Datasheet

    28-6518-112 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-0518-11H

    32-0518-11H

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    3,493
    RFQ
    32-0518-11H

    Datasheet

    32-0518-11H 518 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-6518-111

    32-6518-111

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,872
    RFQ
    32-6518-111

    Datasheet

    32-6518-111 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6518-11H

    28-6518-11H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,573
    RFQ
    28-6518-11H

    Datasheet

    28-6518-11H 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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