Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    24-C212-00

    24-C212-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,004
    RFQ
    24-C212-00

    Datasheet

    24-C212-00 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-C300-00

    24-C300-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,030
    RFQ
    24-C300-00

    Datasheet

    24-C300-00 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-9503-20

    20-9503-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,216
    RFQ
    20-9503-20

    Datasheet

    20-9503-20 503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-9503-30

    20-9503-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,105
    RFQ
    20-9503-30

    Datasheet

    20-9503-30 503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    64-9513-10

    64-9513-10

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    3,876
    RFQ
    64-9513-10

    Datasheet

    64-9513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-71000-10

    16-71000-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    4,490
    RFQ
    16-71000-10

    Datasheet

    16-71000-10 700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-7415-10

    16-7415-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    4,491
    RFQ
    16-7415-10

    Datasheet

    16-7415-10 700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-7440-10

    16-7440-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    3,986
    RFQ
    16-7440-10

    Datasheet

    16-7440-10 700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-7500-10

    16-7500-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    4,456
    RFQ
    16-7500-10

    Datasheet

    16-7500-10 700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-7980-10

    16-7980-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    2,323
    RFQ
    16-7980-10

    Datasheet

    16-7980-10 700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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