Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    17-7500-10

    17-7500-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    2,329
    RFQ
    17-7500-10

    Datasheet

    17-7500-10 700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-7650-10

    17-7650-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    3,020
    RFQ
    17-7650-10

    Datasheet

    17-7650-10 700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-7750-10

    17-7750-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    3,110
    RFQ
    17-7750-10

    Datasheet

    17-7750-10 700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-810-90WR

    16-810-90WR

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,491
    RFQ
    16-810-90WR

    Datasheet

    16-810-90WR Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    28-3503-30

    28-3503-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,162
    RFQ
    28-3503-30

    Datasheet

    28-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-81000-610C

    18-81000-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,428
    RFQ
    18-81000-610C

    Datasheet

    18-81000-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-81180-610C

    18-81180-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,654
    RFQ
    18-81180-610C

    Datasheet

    18-81180-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-81240-610C

    18-81240-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,985
    RFQ
    18-81240-610C

    Datasheet

    18-81240-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-81250-610C

    18-81250-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,965
    RFQ
    18-81250-610C

    Datasheet

    18-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8355-610C

    18-8355-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,871
    RFQ
    18-8355-610C

    Datasheet

    18-8355-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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