Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-0508-20

    30-0508-20

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    3,972
    RFQ
    30-0508-20

    Datasheet

    30-0508-20 508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    64-9513-11

    64-9513-11

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,114
    RFQ
    64-9513-11

    Datasheet

    64-9513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-0508-21

    19-0508-21

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    4,081
    RFQ
    19-0508-21

    Datasheet

    19-0508-21 508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    19-0508-31

    19-0508-31

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    3,066
    RFQ
    19-0508-31

    Datasheet

    19-0508-31 508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    32-3551-10

    32-3551-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    4,454
    RFQ
    32-3551-10

    Datasheet

    32-3551-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3552-10

    32-3552-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    4,034
    RFQ
    32-3552-10

    Datasheet

    32-3552-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3553-10

    32-3553-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    4,806
    RFQ
    32-3553-10

    Datasheet

    32-3553-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6552-10

    32-6552-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,931
    RFQ
    32-6552-10

    Datasheet

    32-6552-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6553-10

    32-6553-10

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    3,237
    RFQ
    32-6553-10

    Datasheet

    32-6553-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6511-11

    32-6511-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,994
    RFQ
    32-6511-11

    Datasheet

    32-6511-11 511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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