Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    28-3503-20

    28-3503-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,152
    RFQ
    28-3503-20

    Datasheet

    28-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    58-1518-00

    58-1518-00

    CONN IC DIP SOCKET 58POS GOLD

    Aries Electronics

    3,984
    RFQ
    58-1518-00

    Datasheet

    58-1518-00 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 58 (2 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-81125-610C

    18-81125-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,466
    RFQ
    18-81125-610C

    Datasheet

    18-81125-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-6503-31

    18-6503-31

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,471
    RFQ
    18-6503-31

    Datasheet

    18-6503-31 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    38-0508-20

    38-0508-20

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    2,237
    RFQ
    38-0508-20

    Datasheet

    38-0508-20 508 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    38-0508-30

    38-0508-30

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    4,769
    RFQ
    38-0508-30

    Datasheet

    38-0508-30 508 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    38-1508-20

    38-1508-20

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,139
    RFQ
    38-1508-20

    Datasheet

    38-1508-20 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    38-1508-30

    38-1508-30

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,383
    RFQ
    38-1508-30

    Datasheet

    38-1508-30 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    27-0501-20

    27-0501-20

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    2,955
    RFQ
    27-0501-20

    Datasheet

    27-0501-20 501 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    27-0501-30

    27-0501-30

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    2,351
    RFQ
    27-0501-30

    Datasheet

    27-0501-30 501 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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