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    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    28-6501-31

    28-6501-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,050
    RFQ
    28-6501-31

    Datasheet

    28-6501-31 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    23-0503-21

    23-0503-21

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    4,719
    RFQ
    23-0503-21

    Datasheet

    23-0503-21 0503 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    68-PGM11033-10H

    68-PGM11033-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,683
    RFQ
    68-PGM11033-10H

    Datasheet

    68-PGM11033-10H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-810-90WR

    18-810-90WR

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,960
    RFQ
    18-810-90WR

    Datasheet

    18-810-90WR Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    48-6556-10

    48-6556-10

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    3,860
    RFQ
    48-6556-10

    Datasheet

    48-6556-10 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    36-6556-10

    36-6556-10

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,969
    RFQ
    36-6556-10

    Datasheet

    36-6556-10 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    36-6820-90C

    36-6820-90C

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,352
    RFQ
    36-6820-90C

    Datasheet

    36-6820-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-6822-90C

    36-6822-90C

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,448
    RFQ
    36-6822-90C

    Datasheet

    36-6822-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-0503-21

    20-0503-21

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    4,762
    RFQ
    20-0503-21

    Datasheet

    20-0503-21 0503 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-0503-31

    20-0503-31

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    3,383
    RFQ
    20-0503-31

    Datasheet

    20-0503-31 0503 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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