Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    27-7530-10

    27-7530-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    2,531
    RFQ
    27-7530-10

    Datasheet

    27-7530-10 700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    27-7550-10

    27-7550-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    4,144
    RFQ
    27-7550-10

    Datasheet

    27-7550-10 700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    27-7650-10

    27-7650-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    2,128
    RFQ
    27-7650-10

    Datasheet

    27-7650-10 700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-6508-302

    40-6508-302

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,435
    RFQ
    40-6508-302

    Datasheet

    40-6508-302 508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    42-6554-10

    42-6554-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    3,226
    RFQ
    42-6554-10

    Datasheet

    42-6554-10 55 Tray Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3552-10

    42-3552-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    2,563
    RFQ
    42-3552-10

    Datasheet

    42-3552-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3553-10

    42-3553-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    4,135
    RFQ
    42-3553-10

    Datasheet

    42-3553-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6552-10

    42-6552-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    4,987
    RFQ
    42-6552-10

    Datasheet

    42-6552-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6553-10

    42-6553-10

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    4,534
    RFQ
    42-6553-10

    Datasheet

    42-6553-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    108-PGM12005-10

    108-PGM12005-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,707
    RFQ
    108-PGM12005-10

    Datasheet

    108-PGM12005-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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