Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-7970-10

    30-7970-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    4,894
    RFQ
    30-7970-10

    Datasheet

    30-7970-10 700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-3570-10

    36-3570-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    3,806
    RFQ
    36-3570-10

    Datasheet

    36-3570-10 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3573-10

    36-3573-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,091
    RFQ
    36-3573-10

    Datasheet

    36-3573-10 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6554-10

    44-6554-10

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    2,774
    RFQ
    44-6554-10

    Datasheet

    44-6554-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    39-0501-30

    39-0501-30

    CONN SOCKET SIP 39POS TIN

    Aries Electronics

    3,745
    RFQ
    39-0501-30

    Datasheet

    39-0501-30 501 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-3508-211

    20-3508-211

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,301
    RFQ
    20-3508-211

    Datasheet

    20-3508-211 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-3508-311

    20-3508-311

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,265
    RFQ
    20-3508-311

    Datasheet

    20-3508-311 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    68-PGM10005-11H

    68-PGM10005-11H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,128
    RFQ
    68-PGM10005-11H

    Datasheet

    68-PGM10005-11H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6501-21

    40-6501-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,788
    RFQ
    40-6501-21

    Datasheet

    40-6501-21 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    23-0503-31

    23-0503-31

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    3,839
    RFQ
    23-0503-31

    Datasheet

    23-0503-31 0503 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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