Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    42-6575-10

    42-6575-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    2,873
    RFQ
    42-6575-10

    Datasheet

    42-6575-10 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    30-0508-21

    30-0508-21

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    4,764
    RFQ
    30-0508-21

    Datasheet

    30-0508-21 508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    30-0508-31

    30-0508-31

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    4,203
    RFQ
    30-0508-31

    Datasheet

    30-0508-31 508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    42-6556-11

    42-6556-11

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    4,724
    RFQ
    42-6556-11

    Datasheet

    42-6556-11 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    32-0501-21

    32-0501-21

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    3,013
    RFQ
    32-0501-21

    Datasheet

    32-0501-21 501 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-0501-31

    32-0501-31

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    4,889
    RFQ
    32-0501-31

    Datasheet

    32-0501-31 501 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-1508-21

    30-1508-21

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,644
    RFQ
    30-1508-21

    Datasheet

    30-1508-21 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    30-1508-31

    30-1508-31

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    4,099
    RFQ
    30-1508-31

    Datasheet

    30-1508-31 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    64-9513-11H

    64-9513-11H

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,477
    RFQ
    64-9513-11H

    Datasheet

    64-9513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-6570-10

    40-6570-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    3,805
    RFQ
    40-6570-10

    Datasheet

    40-6570-10 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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