Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    28-6508-31

    28-6508-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,540
    RFQ
    28-6508-31

    Datasheet

    28-6508-31 508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    100-PGM13061-11

    100-PGM13061-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,691
    RFQ
    100-PGM13061-11

    Datasheet

    100-PGM13061-11 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    100-PGM13069-11

    100-PGM13069-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,638
    RFQ
    100-PGM13069-11

    Datasheet

    100-PGM13069-11 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    42-3553-11

    42-3553-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    2,835
    RFQ
    42-3553-11

    Datasheet

    42-3553-11 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3554-11

    42-3554-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    3,781
    RFQ
    42-3554-11

    Datasheet

    42-3554-11 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6554-11

    42-6554-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    2,400
    RFQ
    42-6554-11

    Datasheet

    42-6554-11 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3508-21

    28-3508-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,482
    RFQ
    28-3508-21

    Datasheet

    28-3508-21 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-3508-31

    28-3508-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,820
    RFQ
    28-3508-31

    Datasheet

    28-3508-31 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6575-11

    32-6575-11

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,602
    RFQ
    32-6575-11

    Datasheet

    32-6575-11 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3570-11

    36-3570-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    2,432
    RFQ
    36-3570-11

    Datasheet

    36-3570-11 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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