Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    175-PGM16003-11H

    175-PGM16003-11H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,247
    RFQ
    175-PGM16003-11H

    Datasheet

    175-PGM16003-11H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    175-PGM16008-11

    175-PGM16008-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,133
    RFQ
    175-PGM16008-11

    Datasheet

    175-PGM16008-11 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    64-9503-21

    64-9503-21

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    3,664
    RFQ
    64-9503-21

    Datasheet

    64-9503-21 503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    64-9503-31

    64-9503-31

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    3,619
    RFQ
    64-9503-31

    Datasheet

    64-9503-31 503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6556-41

    32-6556-41

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,531
    RFQ
    32-6556-41

    Datasheet

    32-6556-41 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    124-PGM13008-41

    124-PGM13008-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,988
    RFQ
    124-PGM13008-41

    Datasheet

    124-PGM13008-41 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6553-16

    24-6553-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    3,350
    RFQ
    24-6553-16

    Datasheet

    24-6553-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6556-40

    36-6556-40

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,782
    RFQ
    36-6556-40

    Datasheet

    36-6556-40 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    192-PGM17025-11

    192-PGM17025-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,742
    RFQ
    192-PGM17025-11

    Datasheet

    192-PGM17025-11 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6572-16

    24-6572-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    2,612
    RFQ
    24-6572-16

    Datasheet

    24-6572-16 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
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