Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    84-PRS11032-12

    84-PRS11032-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,285
    RFQ
    84-PRS11032-12

    Datasheet

    84-PRS11032-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    84-PRS12022-12

    84-PRS12022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,132
    RFQ
    84-PRS12022-12

    Datasheet

    84-PRS12022-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    84-PRS13053-12

    84-PRS13053-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,804
    RFQ
    84-PRS13053-12

    Datasheet

    84-PRS13053-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    84-PRS13125-12

    84-PRS13125-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,628
    RFQ
    84-PRS13125-12

    Datasheet

    84-PRS13125-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    44-3573-16

    44-3573-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    3,473
    RFQ
    44-3573-16

    Datasheet

    44-3573-16 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    18-PRS17041-12

    18-PRS17041-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,357
    RFQ
    18-PRS17041-12

    Datasheet

    18-PRS17041-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    56-PRS15057-12

    56-PRS15057-12

    ZIF PGA SOCKET 56PIN 15X15

    Aries Electronics

    2,040
    RFQ

    -

    56-PRS15057-12 PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
    56-PLS15057-12

    56-PLS15057-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,128
    RFQ
    56-PLS15057-12

    Datasheet

    56-PLS15057-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    40-3551-16

    40-3551-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    2,246
    RFQ
    40-3551-16

    Datasheet

    40-3551-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3552-16

    40-3552-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,341
    RFQ
    40-3552-16

    Datasheet

    40-3552-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 4131 Record«Prev1... 370371372373374375376377...414Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER