Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    441-PGG21001-40

    441-PGG21001-40

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,421
    RFQ
    441-PGG21001-40

    Datasheet

    441-PGG21001-40 PGG Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    85-PRS11008-12

    85-PRS11008-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,498
    RFQ
    85-PRS11008-12

    Datasheet

    85-PRS11008-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    169-PLS13001-12

    169-PLS13001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,652
    RFQ
    169-PLS13001-12

    Datasheet

    169-PLS13001-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    225-PGM15001-51

    225-PGM15001-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,570
    RFQ
    225-PGM15001-51

    Datasheet

    225-PGM15001-51 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    96-PRS14024-12

    96-PRS14024-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,896
    RFQ
    96-PRS14024-12

    Datasheet

    96-PRS14024-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    84-536-11

    84-536-11

    CONN SOCKET PLCC ZIF 84POS GOLD

    Aries Electronics

    3,461
    RFQ

    -

    84-536-11 536 - Obsolete PLCC, ZIF (ZIP) 84 (4 x 21) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
    56-PLS14031-12

    56-PLS14031-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,842
    RFQ
    56-PLS14031-12

    Datasheet

    56-PLS14031-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    56-PRS14031-12

    56-PRS14031-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,679
    RFQ
    56-PRS14031-12

    Datasheet

    56-PRS14031-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    44-6552-16

    44-6552-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    3,866
    RFQ
    44-6552-16

    Datasheet

    44-6552-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3554-16

    44-3554-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    3,296
    RFQ
    44-3554-16

    Datasheet

    44-3554-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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