Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    28-6572-18

    28-6572-18

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    4,939
    RFQ
    28-6572-18

    Datasheet

    28-6572-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6573-18

    28-6573-18

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    3,334
    RFQ
    28-6573-18

    Datasheet

    28-6573-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6574-18

    28-6574-18

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    2,851
    RFQ
    28-6574-18

    Datasheet

    28-6574-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    256-PLS16001-12

    256-PLS16001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,252
    RFQ
    256-PLS16001-12

    Datasheet

    256-PLS16001-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    229-PGM16015-10T

    229-PGM16015-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    3,775
    RFQ
    229-PGM16015-10T

    Datasheet

    229-PGM16015-10T PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    156-PLS16011-12

    156-PLS16011-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,757
    RFQ
    156-PLS16011-12

    Datasheet

    156-PLS16011-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    156-PRS16011-12

    156-PRS16011-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,459
    RFQ
    156-PRS16011-12

    Datasheet

    156-PRS16011-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    24-3574-18

    24-3574-18

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,024
    RFQ
    24-3574-18

    Datasheet

    24-3574-18 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6551-18

    36-6551-18

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    4,745
    RFQ

    -

    36-6551-18 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    28-3575-18

    28-3575-18

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    3,655
    RFQ
    28-3575-18

    Datasheet

    28-3575-18 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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