| Photo | Mfr. Part # | Availability | Quantity | Datasheet | RoHs | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
                 
                 
                
                 | 
				
                    216-PLS21016-12CONN SOCKET PGA ZIF GOLD Aries Electronics  |  
                2,127 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | |
                 
                 
                
                 | 
				
                    36-3574-18CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics  |  
                2,464 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    36-6574-18CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics  |  
                2,611 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    36-6575-18CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics  |  
                3,666 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    336-PRS21022-12CONN SOCKET PGA ZIF GOLD Aries Electronics  |  
                2,495 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | |
                 
                 
                
                 | 
				
                    281-PLS19012-12CONN SOCKET PGA ZIF GOLD Aries Electronics  |  
                2,475 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | |
                 
                 
                
                 | 
				
                    240-PRS20014-12CONN SOCKET PGA ZIF GOLD Aries Electronics  |  
                2,890 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | |
                 
                 
                
                 | 
				
                    40-3574-18CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics  |  
                2,026 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    40-6574-18CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics  |  
                2,457 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    273-PRS21004-12CONN SOCKET PGA ZIF GOLD Aries Electronics  |  
                4,208 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |