Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    13-0518-11H

    13-0518-11H

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    4,481
    RFQ
    13-0518-11H

    Datasheet

    13-0518-11H 518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-6513-10T

    14-6513-10T

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,099
    RFQ
    14-6513-10T

    Datasheet

    14-6513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-0518-10H

    20-0518-10H

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    2,738
    RFQ
    20-0518-10H

    Datasheet

    20-0518-10H 518 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    03-0508-21

    03-0508-21

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,396
    RFQ
    03-0508-21

    Datasheet

    03-0508-21 508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    03-0508-31

    03-0508-31

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    4,765
    RFQ
    03-0508-31

    Datasheet

    03-0508-31 508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    33-0518-10

    33-0518-10

    CONN SOCKET SIP 33POS GOLD

    Aries Electronics

    2,947
    RFQ
    33-0518-10

    Datasheet

    33-0518-10 518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0508-20

    08-0508-20

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    2,674
    RFQ
    08-0508-20

    Datasheet

    08-0508-20 508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    08-0508-30

    08-0508-30

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    2,526
    RFQ
    08-0508-30

    Datasheet

    08-0508-30 508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    08-1508-20

    08-1508-20

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,609
    RFQ
    08-1508-20

    Datasheet

    08-1508-20 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    08-1508-30

    08-1508-30

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,465
    RFQ
    08-1508-30

    Datasheet

    08-1508-30 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
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