Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    11-0508-30

    11-0508-30

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,187
    RFQ
    11-0508-30

    Datasheet

    11-0508-30 508 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-3518-101H

    16-3518-101H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,244
    RFQ
    16-3518-101H

    Datasheet

    16-3518-101H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    30-0518-10T

    30-0518-10T

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    4,797
    RFQ
    30-0518-10T

    Datasheet

    30-0518-10T 518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-6513-11

    20-6513-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,147
    RFQ
    20-6513-11

    Datasheet

    20-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-0513-11

    20-0513-11

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    3,746
    RFQ
    20-0513-11

    Datasheet

    20-0513-11 0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0513-10H

    23-0513-10H

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    4,288
    RFQ
    23-0513-10H

    Datasheet

    23-0513-10H 0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-4518-10M

    20-4518-10M

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,203
    RFQ
    20-4518-10M

    Datasheet

    20-4518-10M 518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-0518-10H

    38-0518-10H

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    2,151
    RFQ
    38-0518-10H

    Datasheet

    38-0518-10H 518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-1518-10H

    38-1518-10H

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,142
    RFQ
    38-1518-10H

    Datasheet

    38-1518-10H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-6513-10T

    24-6513-10T

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,465
    RFQ
    24-6513-10T

    Datasheet

    24-6513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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