Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    02-7425-11

    02-7425-11

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,104
    RFQ
    02-7425-11

    Datasheet

    02-7425-11 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    23-0518-00

    23-0518-00

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    4,577
    RFQ
    23-0518-00

    Datasheet

    23-0518-00 518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    33-0518-11

    33-0518-11

    CONN SOCKET SIP 33POS GOLD

    Aries Electronics

    2,576
    RFQ
    33-0518-11

    Datasheet

    33-0518-11 518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    13-0517-90C

    13-0517-90C

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,667
    RFQ
    13-0517-90C

    Datasheet

    13-0517-90C 0517 Bulk Active SIP 13 (1 x 13) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    30-0518-10H

    30-0518-10H

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    2,563
    RFQ
    30-0518-10H

    Datasheet

    30-0518-10H 518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    30-1518-10H

    30-1518-10H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,072
    RFQ
    30-1518-10H

    Datasheet

    30-1518-10H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    30-3513-10

    30-3513-10

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,146
    RFQ
    30-3513-10

    Datasheet

    30-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-3503-20

    08-3503-20

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,916
    RFQ
    08-3503-20

    Datasheet

    08-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-3503-30

    08-3503-30

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,213
    RFQ
    08-3503-30

    Datasheet

    08-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-3513-10

    24-3513-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,321
    RFQ
    24-3513-10

    Datasheet

    24-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 4131 Record«Prev1... 8182838485868788...414Next»
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