Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    04-7950-10

    04-7950-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    4,905
    RFQ
    04-7950-10

    Datasheet

    04-7950-10 700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-6513-10

    40-6513-10

    40 POS LOW PROF SOCK SERIES 513

    Aries Electronics

    2,145
    RFQ

    -

    40-6513-10 513 - Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-C195-11

    14-C195-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,488
    RFQ
    14-C195-11

    Datasheet

    14-C195-11 EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-C280-11

    14-C280-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,007
    RFQ
    14-C280-11

    Datasheet

    14-C280-11 EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    06-81000-310C

    06-81000-310C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,570
    RFQ
    06-81000-310C

    Datasheet

    06-81000-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-81140-310C

    06-81140-310C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,826
    RFQ
    06-81140-310C

    Datasheet

    06-81140-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-81250-310C

    06-81250-310C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,427
    RFQ
    06-81250-310C

    Datasheet

    06-81250-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-8285-310C

    06-8285-310C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,651
    RFQ
    06-8285-310C

    Datasheet

    06-8285-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-8300-310C

    06-8300-310C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,975
    RFQ
    06-8300-310C

    Datasheet

    06-8300-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-8590-310C

    06-8590-310C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,927
    RFQ
    06-8590-310C

    Datasheet

    06-8590-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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