Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICF-324-TL-I-TR

    ICF-324-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,996
    RFQ
    ICF-324-TL-I-TR

    Datasheet

    ICF-324-TL-I-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-324-STL-I-TR

    ICF-324-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,275
    RFQ
    ICF-324-STL-I-TR

    Datasheet

    ICF-324-STL-I-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    510-87-153-15-061101

    510-87-153-15-061101

    CONN SOCKET PGA 153POS GOLD

    Preci-Dip

    4,385
    RFQ
    510-87-153-15-061101

    Datasheet

    510-87-153-15-061101 510 Bulk Active PGA 153 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-8430-10WR

    16-8430-10WR

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    4,102
    RFQ
    16-8430-10WR

    Datasheet

    16-8430-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-314-ZNGT

    ICO-314-ZNGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,354
    RFQ
    ICO-314-ZNGT

    Datasheet

    ICO-314-ZNGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-ZWGG-2

    ICA-308-ZWGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,463
    RFQ
    ICA-308-ZWGG-2

    Datasheet

    ICA-308-ZWGG-2 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    10-2511-11

    10-2511-11

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,256
    RFQ
    10-2511-11

    Datasheet

    10-2511-11 511 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-6513-10H

    16-6513-10H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,886
    RFQ
    16-6513-10H

    Datasheet

    16-6513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-6513-11H

    16-6513-11H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,668
    RFQ
    16-6513-11H

    Datasheet

    16-6513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    XR2A-2471-N

    XR2A-2471-N

    IC CONNECTOR

    Omron Electronics Inc-EMC Div

    4,679
    RFQ

    -

    XR2A-2471-N * Bulk Active - - - - - - - - - - - - - - -
    XR2A-2401-N

    XR2A-2401-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    4,394
    RFQ
    XR2A-2401-N

    Datasheet

    XR2A-2401-N XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    50-9518-10

    50-9518-10

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    2,931
    RFQ
    50-9518-10

    Datasheet

    50-9518-10 518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    36-6513-10

    36-6513-10

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,473
    RFQ
    36-6513-10

    Datasheet

    36-6513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    27-0518-00

    27-0518-00

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    4,569
    RFQ
    27-0518-00

    Datasheet

    27-0518-00 518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0518-11H

    23-0518-11H

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    4,430
    RFQ
    23-0518-11H

    Datasheet

    23-0518-11H 518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    BU640Z-178-HT

    BU640Z-178-HT

    CONN IC DIP SOCKET 64POS GOLD

    On Shore Technology Inc.

    3,442
    RFQ
    BU640Z-178-HT

    Datasheet

    BU640Z-178-HT BU-178HT Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    ICO-316-LGT

    ICO-316-LGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,921
    RFQ
    ICO-316-LGT

    Datasheet

    ICO-316-LGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    04-0511-11

    04-0511-11

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,280
    RFQ
    04-0511-11

    Datasheet

    04-0511-11 511 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    123-87-648-41-001101

    123-87-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,635
    RFQ
    123-87-648-41-001101

    Datasheet

    123-87-648-41-001101 123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-624-ZSST-L

    ICO-624-ZSST-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,335
    RFQ
    ICO-624-ZSST-L

    Datasheet

    ICO-624-ZSST-L ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
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