Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    08-8900-310C

    08-8900-310C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,842
    RFQ
    08-8900-310C

    Datasheet

    08-8900-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-8937-610C

    08-8937-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,974
    RFQ
    08-8937-610C

    Datasheet

    08-8937-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-6513-11

    28-6513-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,347
    RFQ
    28-6513-11

    Datasheet

    28-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3518-10E

    14-3518-10E

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,813
    RFQ
    14-3518-10E

    Datasheet

    14-3518-10E 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-650-41-006101

    116-83-650-41-006101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,024
    RFQ
    116-83-650-41-006101

    Datasheet

    116-83-650-41-006101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    8114LB603

    8114LB603

    THM,11692 REV J

    Boyd Laconia, LLC

    2,677
    RFQ

    -

    8114LB603 - Bulk Active - - - - - - - - - - - - - - -
    117-87-668-41-105101

    117-87-668-41-105101

    CONN IC DIP SOCKET 68POS GOLD

    Preci-Dip

    2,316
    RFQ
    117-87-668-41-105101

    Datasheet

    117-87-668-41-105101 117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-WGG-3

    ICA-308-WGG-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,548
    RFQ
    ICA-308-WGG-3

    Datasheet

    ICA-308-WGG-3 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-ZSST

    ICA-624-ZSST

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,793
    RFQ
    ICA-624-ZSST

    Datasheet

    ICA-624-ZSST ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0314-TT-2

    HLS-0314-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,324
    RFQ
    HLS-0314-TT-2

    Datasheet

    HLS-0314-TT-2 HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    08-6501-21

    08-6501-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,237
    RFQ
    08-6501-21

    Datasheet

    08-6501-21 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-87-650-41-007101

    116-87-650-41-007101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,213
    RFQ
    116-87-650-41-007101

    Datasheet

    116-87-650-41-007101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    346-93-119-41-013000

    346-93-119-41-013000

    CONN SOCKET SIP 19POS GOLD

    Mill-Max Manufacturing Corp.

    4,355
    RFQ
    346-93-119-41-013000

    Datasheet

    346-93-119-41-013000 346 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-119-41-013000

    346-43-119-41-013000

    CONN SOCKET SIP 19POS GOLD

    Mill-Max Manufacturing Corp.

    4,138
    RFQ
    346-43-119-41-013000

    Datasheet

    346-43-119-41-013000 346 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-328-S-O-TR

    ICF-328-S-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,626
    RFQ
    ICF-328-S-O-TR

    Datasheet

    ICF-328-S-O-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    08-6501-31

    08-6501-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,713
    RFQ
    08-6501-31

    Datasheet

    08-6501-31 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-0508-21

    08-0508-21

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,687
    RFQ
    08-0508-21

    Datasheet

    08-0508-21 508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-0508-31

    08-0508-31

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,299
    RFQ
    08-0508-31

    Datasheet

    08-0508-31 508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-1508-21

    08-1508-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,436
    RFQ
    08-1508-21

    Datasheet

    08-1508-21 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-1508-31

    08-1508-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,278
    RFQ
    08-1508-31

    Datasheet

    08-1508-31 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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