Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    13-0503-30

    13-0503-30

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,267
    RFQ
    13-0503-30

    Datasheet

    13-0503-30 0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    08-2810-90T

    08-2810-90T

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    4,394
    RFQ
    08-2810-90T

    Datasheet

    08-2810-90T Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    3-1437538-2

    3-1437538-2

    CONN IC DIP SOCKET 40POS TINLEAD

    TE Connectivity AMP Connectors

    4,171
    RFQ
    3-1437538-2

    Datasheet

    3-1437538-2 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    510-83-101-15-101101

    510-83-101-15-101101

    CONN SOCKET PGA 101POS GOLD

    Preci-Dip

    2,675
    RFQ
    510-83-101-15-101101

    Datasheet

    510-83-101-15-101101 510 Bulk Active PGA 101 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-43-314-41-801000

    123-43-314-41-801000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    4,861
    RFQ
    123-43-314-41-801000

    Datasheet

    123-43-314-41-801000 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-87-648-41-001101

    122-87-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,282
    RFQ
    122-87-648-41-001101

    Datasheet

    122-87-648-41-001101 122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-176-15-061101

    510-87-176-15-061101

    CONN SOCKET PGA 176POS GOLD

    Preci-Dip

    3,822
    RFQ
    510-87-176-15-061101

    Datasheet

    510-87-176-15-061101 510 Bulk Active PGA 176 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0111-G-22

    HLS-0111-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,268
    RFQ
    HLS-0111-G-22

    Datasheet

    HLS-0111-G-22 HLS Tube Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    14-6513-11H

    14-6513-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,872
    RFQ
    14-6513-11H

    Datasheet

    14-6513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3518-111

    16-3518-111

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,558
    RFQ
    16-3518-111

    Datasheet

    16-3518-111 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-3518-101H

    20-3518-101H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,171
    RFQ
    20-3518-101H

    Datasheet

    20-3518-101H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-3518-101

    24-3518-101

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,186
    RFQ
    24-3518-101

    Datasheet

    24-3518-101 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    17-0511-10

    17-0511-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    2,413
    RFQ
    17-0511-10

    Datasheet

    17-0511-10 511 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-0513-11H

    24-0513-11H

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,505
    RFQ
    24-0513-11H

    Datasheet

    24-0513-11H 0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    25-0513-11H

    25-0513-11H

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    2,288
    RFQ
    25-0513-11H

    Datasheet

    25-0513-11H 0513 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-0508-20

    16-0508-20

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    4,923
    RFQ
    16-0508-20

    Datasheet

    16-0508-20 508 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-1508-20

    16-1508-20

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,753
    RFQ
    16-1508-20

    Datasheet

    16-1508-20 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    116-87-632-41-004101

    116-87-632-41-004101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,997
    RFQ
    116-87-632-41-004101

    Datasheet

    116-87-632-41-004101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    824-AG11D

    824-AG11D

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    2,729
    RFQ
    824-AG11D

    Datasheet

    824-AG11D 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    18-3513-11H

    18-3513-11H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,649
    RFQ
    18-3513-11H

    Datasheet

    18-3513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 314315316317318319320321...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER