Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICA-314-WGG-2

    ICA-314-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,952
    RFQ
    ICA-314-WGG-2

    Datasheet

    ICA-314-WGG-2 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    40-3513-10

    40-3513-10

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,679
    RFQ
    40-3513-10

    Datasheet

    40-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-114-13-001101

    510-83-114-13-001101

    CONN SOCKET PGA 114POS GOLD

    Preci-Dip

    3,541
    RFQ
    510-83-114-13-001101

    Datasheet

    510-83-114-13-001101 510 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-114-13-062101

    510-83-114-13-062101

    CONN SOCKET PGA 114POS GOLD

    Preci-Dip

    4,664
    RFQ
    510-83-114-13-062101

    Datasheet

    510-83-114-13-062101 510 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-652-41-035101

    146-83-652-41-035101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,702
    RFQ
    146-83-652-41-035101

    Datasheet

    146-83-652-41-035101 146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-652-41-036101

    146-83-652-41-036101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,516
    RFQ
    146-83-652-41-036101

    Datasheet

    146-83-652-41-036101 146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0310-T-2

    HLS-0310-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,475
    RFQ
    HLS-0310-T-2

    Datasheet

    HLS-0310-T-2 HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    550-10-037-10-061101

    550-10-037-10-061101

    PGA SOLDER TAIL

    Preci-Dip

    4,824
    RFQ
    550-10-037-10-061101

    Datasheet

    550-10-037-10-061101 550 Bulk Active PGA 37 (10 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-MGG

    ICO-316-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,700
    RFQ
    ICO-316-MGG

    Datasheet

    ICO-316-MGG ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    XR2C-2002

    XR2C-2002

    CONN SOCKET SIP 20POS GOLD

    Omron Electronics Inc-EMC Div

    3,025
    RFQ
    XR2C-2002

    Datasheet

    XR2C-2002 XR2 Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    50-9513-10

    50-9513-10

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    2,027
    RFQ
    50-9513-10

    Datasheet

    50-9513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-0517-90C

    21-0517-90C

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    2,058
    RFQ
    21-0517-90C

    Datasheet

    21-0517-90C 0517 Bulk Active SIP 21 (1 x 21) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6513-10H

    28-6513-10H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,208
    RFQ
    28-6513-10H

    Datasheet

    28-6513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-9513-10

    32-9513-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,865
    RFQ
    32-9513-10

    Datasheet

    32-9513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-4518-10H

    24-4518-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,703
    RFQ
    24-4518-10H

    Datasheet

    24-4518-10H 518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-318-NGT

    ICO-318-NGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,920
    RFQ
    ICO-318-NGT

    Datasheet

    ICO-318-NGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    126-41-304-41-001000

    126-41-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,491
    RFQ
    126-41-304-41-001000

    Datasheet

    126-41-304-41-001000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-304-41-001000

    126-91-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,697
    RFQ
    126-91-304-41-001000

    Datasheet

    126-91-304-41-001000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    PGA145H003B1-1521R

    PGA145H003B1-1521R

    PGA SOCKET 145 CTS

    Amphenol ICC (FCI)

    4,011
    RFQ
    PGA145H003B1-1521R

    Datasheet

    PGA145H003B1-1521R - - Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    ICF-648-T-O

    ICF-648-T-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,963
    RFQ
    ICF-648-T-O

    Datasheet

    ICF-648-T-O ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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