Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICF-640-S-I-TR

    ICF-640-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,158
    RFQ
    ICF-640-S-I-TR

    Datasheet

    ICF-640-S-I-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    614-41-304-31-007000

    614-41-304-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,131
    RFQ
    614-41-304-31-007000

    Datasheet

    614-41-304-31-007000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-31-007000

    614-91-304-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,181
    RFQ
    614-91-304-31-007000

    Datasheet

    614-91-304-31-007000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    2229490-2

    2229490-2

    CONN SOCKET PGA ZIF 947POS GOLD

    TE Connectivity AMP Connectors

    2,510
    RFQ
    2229490-2

    Datasheet

    2229490-2 - Tape & Reel (TR) Active PGA, ZIF (ZIP) 947 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic -
    HLS-0505-T-2

    HLS-0505-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,008
    RFQ
    HLS-0505-T-2

    Datasheet

    HLS-0505-T-2 HLS Bulk Active SIP 25 (5 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    40-6518-10M

    40-6518-10M

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,511
    RFQ
    40-6518-10M

    Datasheet

    40-6518-10M 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-650-41-002101

    116-83-650-41-002101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,532
    RFQ
    116-83-650-41-002101

    Datasheet

    116-83-650-41-002101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-208-17-081101

    510-87-208-17-081101

    CONN SOCKET PGA 208POS GOLD

    Preci-Dip

    3,125
    RFQ
    510-87-208-17-081101

    Datasheet

    510-87-208-17-081101 510 Bulk Active PGA 208 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-3511-11

    20-3511-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,028
    RFQ
    20-3511-11

    Datasheet

    20-3511-11 511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0119-T-10

    HLS-0119-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,768
    RFQ
    HLS-0119-T-10

    Datasheet

    HLS-0119-T-10 HLS Tube Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APH-1908-T-R

    APH-1908-T-R

    APH-1908-T-R

    Samtec Inc.

    4,753
    RFQ

    -

    APH-1908-T-R * - Active - - - - - - - - - - - - - - -
    APH-0408-T-R

    APH-0408-T-R

    APH-0408-T-R

    Samtec Inc.

    4,464
    RFQ

    -

    APH-0408-T-R * - Active - - - - - - - - - - - - - - -
    APH-0908-T-R

    APH-0908-T-R

    APH-0908-T-R

    Samtec Inc.

    3,059
    RFQ

    -

    APH-0908-T-R * - Active - - - - - - - - - - - - - - -
    510-87-236-17-062101

    510-87-236-17-062101

    CONN SOCKET PGA 236POS GOLD

    Preci-Dip

    2,905
    RFQ
    510-87-236-17-062101

    Datasheet

    510-87-236-17-062101 510 Bulk Active PGA 236 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-41-304-31-018000

    614-41-304-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,347
    RFQ
    614-41-304-31-018000

    Datasheet

    614-41-304-31-018000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-31-018000

    614-91-304-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,019
    RFQ
    614-91-304-31-018000

    Datasheet

    614-91-304-31-018000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6518-112

    32-6518-112

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,053
    RFQ
    32-6518-112

    Datasheet

    32-6518-112 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-316-AGG

    ICA-316-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,208
    RFQ
    ICA-316-AGG

    Datasheet

    ICA-316-AGG ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    XR2A-4001-N

    XR2A-4001-N

    CONN IC DIP SOCKET 40POS GOLD

    Omron Electronics Inc-EMC Div

    3,881
    RFQ
    XR2A-4001-N

    Datasheet

    XR2A-4001-N XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    ICO-322-LGG

    ICO-322-LGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,783
    RFQ
    ICO-322-LGG

    Datasheet

    ICO-322-LGG ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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