Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APA-314-T-B

    APA-314-T-B

    ADAPTER PLUG

    Samtec Inc.

    3,363
    RFQ
    APA-314-T-B

    Datasheet

    APA-314-T-B APA Bulk Active - 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    121-13-304-41-001000

    121-13-304-41-001000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    3,612
    RFQ
    121-13-304-41-001000

    Datasheet

    121-13-304-41-001000 121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    08-6503-21

    08-6503-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,972
    RFQ
    08-6503-21

    Datasheet

    08-6503-21 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-6503-31

    08-6503-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,025
    RFQ
    08-6503-31

    Datasheet

    08-6503-31 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6513-10H

    24-6513-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,206
    RFQ
    24-6513-10H

    Datasheet

    24-6513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    346-93-129-41-013000

    346-93-129-41-013000

    CONN SOCKET SIP 29POS GOLD

    Mill-Max Manufacturing Corp.

    2,957
    RFQ
    346-93-129-41-013000

    Datasheet

    346-93-129-41-013000 346 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-129-41-013000

    346-43-129-41-013000

    CONN SOCKET SIP 29POS GOLD

    Mill-Max Manufacturing Corp.

    3,165
    RFQ
    346-43-129-41-013000

    Datasheet

    346-43-129-41-013000 346 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6513-11

    40-6513-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,955
    RFQ
    40-6513-11

    Datasheet

    40-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-320-ZSGG

    ICA-320-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,284
    RFQ
    ICA-320-ZSGG

    Datasheet

    ICA-320-ZSGG ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    37-0518-11H

    37-0518-11H

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    4,553
    RFQ
    37-0518-11H

    Datasheet

    37-0518-11H 518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-810-90RWR

    14-810-90RWR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,912
    RFQ
    14-810-90RWR

    Datasheet

    14-810-90RWR Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    ICA-422-SGG-L

    ICA-422-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,902
    RFQ
    ICA-422-SGG-L

    Datasheet

    ICA-422-SGG-L ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-636-41-004101

    116-83-636-41-004101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,775
    RFQ
    116-83-636-41-004101

    Datasheet

    116-83-636-41-004101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3518-111

    28-3518-111

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,168
    RFQ
    28-3518-111

    Datasheet

    28-3518-111 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6518-111

    28-6518-111

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,511
    RFQ
    28-6518-111

    Datasheet

    28-6518-111 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-225-15-000101

    510-87-225-15-000101

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    3,056
    RFQ
    510-87-225-15-000101

    Datasheet

    510-87-225-15-000101 510 Bulk Active PGA 225 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-422-T-J

    APO-422-T-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,744
    RFQ

    -

    APO-422-T-J * - Active - - - - - - - - - - - - - - -
    HLS-0209-G-11

    HLS-0209-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,551
    RFQ
    HLS-0209-G-11

    Datasheet

    HLS-0209-G-11 HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0308-G-2

    HLS-0308-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,523
    RFQ
    HLS-0308-G-2

    Datasheet

    HLS-0308-G-2 HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    12-0503-21

    12-0503-21

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    2,964
    RFQ
    12-0503-21

    Datasheet

    12-0503-21 0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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