Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-47-304-41-001000

    116-47-304-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,721
    RFQ
    116-47-304-41-001000

    Datasheet

    116-47-304-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0311-T-22

    HLS-0311-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,289
    RFQ
    HLS-0311-T-22

    Datasheet

    HLS-0311-T-22 HLS Tube Active SIP 33 (3 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    15-0503-20

    15-0503-20

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    4,281
    RFQ
    15-0503-20

    Datasheet

    15-0503-20 0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    122-13-304-41-001000

    122-13-304-41-001000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    3,540
    RFQ
    122-13-304-41-001000

    Datasheet

    122-13-304-41-001000 122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-83-626-10-002101

    299-83-626-10-002101

    CONN IC DIP SOCKET 26POS GOLD

    Preci-Dip

    2,859
    RFQ
    299-83-626-10-002101

    Datasheet

    299-83-626-10-002101 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-3518-10E

    18-3518-10E

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,670
    RFQ
    18-3518-10E

    Datasheet

    18-3518-10E 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    714-43-124-31-018000

    714-43-124-31-018000

    CONN SOCKET SIP 24POS GOLD

    Mill-Max Manufacturing Corp.

    3,778
    RFQ
    714-43-124-31-018000

    Datasheet

    714-43-124-31-018000 714 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-628-SGG-L

    ICO-628-SGG-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,878
    RFQ
    ICO-628-SGG-L

    Datasheet

    ICO-628-SGG-L ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-WGG-2

    ICA-318-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,054
    RFQ
    ICA-318-WGG-2

    Datasheet

    ICA-318-WGG-2 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-ZWGG-3

    ICA-314-ZWGG-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,637
    RFQ
    ICA-314-ZWGG-3

    Datasheet

    ICA-314-ZWGG-3 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    39-0518-11H

    39-0518-11H

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    4,024
    RFQ
    39-0518-11H

    Datasheet

    39-0518-11H 518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-81000-310C

    14-81000-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,208
    RFQ
    14-81000-310C

    Datasheet

    14-81000-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-81010-310C

    14-81010-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,968
    RFQ
    14-81010-310C

    Datasheet

    14-81010-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-81040-310C

    14-81040-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,219
    RFQ
    14-81040-310C

    Datasheet

    14-81040-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-81200-310C

    14-81200-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,187
    RFQ
    14-81200-310C

    Datasheet

    14-81200-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-81250-310C

    14-81250-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,278
    RFQ
    14-81250-310C

    Datasheet

    14-81250-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8250-310C

    14-8250-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,829
    RFQ
    14-8250-310C

    Datasheet

    14-8250-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8270-310C

    14-8270-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,314
    RFQ
    14-8270-310C

    Datasheet

    14-8270-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8275-310C

    14-8275-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,082
    RFQ
    14-8275-310C

    Datasheet

    14-8275-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8290-310C

    14-8290-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,467
    RFQ
    14-8290-310C

    Datasheet

    14-8290-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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