Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    16-8560-310C

    16-8560-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,678
    RFQ
    16-8560-310C

    Datasheet

    16-8560-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8561-310C

    16-8561-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,757
    RFQ
    16-8561-310C

    Datasheet

    16-8561-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8590-310C

    16-8590-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,753
    RFQ
    16-8590-310C

    Datasheet

    16-8590-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8600-310C

    16-8600-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,492
    RFQ
    16-8600-310C

    Datasheet

    16-8600-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8608-310C

    16-8608-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,201
    RFQ
    16-8608-310C

    Datasheet

    16-8608-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8620-310C

    16-8620-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,529
    RFQ
    16-8620-310C

    Datasheet

    16-8620-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8625-310C

    16-8625-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,043
    RFQ
    16-8625-310C

    Datasheet

    16-8625-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8633-310C

    16-8633-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,625
    RFQ
    16-8633-310C

    Datasheet

    16-8633-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8720-310C

    16-8720-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,995
    RFQ
    16-8720-310C

    Datasheet

    16-8720-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8750-310C

    16-8750-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,104
    RFQ
    16-8750-310C

    Datasheet

    16-8750-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8800-310C

    16-8800-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,534
    RFQ
    16-8800-310C

    Datasheet

    16-8800-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8810-310C

    16-8810-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,359
    RFQ
    16-8810-310C

    Datasheet

    16-8810-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8850-310C

    16-8850-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,191
    RFQ
    16-8850-310C

    Datasheet

    16-8850-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8990-310C

    16-8990-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,878
    RFQ
    16-8990-310C

    Datasheet

    16-8990-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0310-T-11

    HLS-0310-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,818
    RFQ
    HLS-0310-T-11

    Datasheet

    HLS-0310-T-11 HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    HLS-0406-T-2

    HLS-0406-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,456
    RFQ
    HLS-0406-T-2

    Datasheet

    HLS-0406-T-2 HLS Bulk Active SIP 24 (4 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    117-93-664-41-005000

    117-93-664-41-005000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    4,823
    RFQ
    117-93-664-41-005000

    Datasheet

    117-93-664-41-005000 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-640-WTT-2

    ICA-640-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,751
    RFQ
    ICA-640-WTT-2

    Datasheet

    ICA-640-WTT-2 ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    3-1825046-0

    3-1825046-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    3,285
    RFQ

    -

    3-1825046-0 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) - - Brass - -
    ICA-648-WTT-2

    ICA-648-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,169
    RFQ
    ICA-648-WTT-2

    Datasheet

    ICA-648-WTT-2 ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
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